Singapore Temasek Issues RMB 750 Million 5-Year Bond Due 2029 with 3.2% Coupon Equivalent to $105 Million in USD, Bonds Expected to be Issued on 6th February 2024 & Listing on Singapore Exchange on 7th February 2024
1st February 2024 | Hong Kong
Singapore Temasek is issuing a new RMB 750 million 5-year bond due 2029 with 3.2% coupon equivalent ($105 million), with the bonds expected to be issued on 6th February 2024 & listing on Singapore Exchange (SGX) on 7th February 2024. The new bond issue – Temasek Financial (I) bonds are unconditionally and irrevocably guaranteed by Temasek.
“ Singapore Temasek Issues RMB 750 Million 5-Year Bond with 3.2% Coupon Due 2029 Equivalent to $105 Million in USD, Bonds Expected to be Issued on 6th February 2024 & Listing on Singapore Exchange on 7th February 2024 “
Singapore Temasek Issues RMB 750 Million 5-Year Bond with 3.2% Coupon Due 2029 Equivalent to $105 Million in USD
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