Singapore Exchange to Issue S$300 Million 3-Year Bond with 3.45% Coupon in Denomination of S$250,000 Maturing February 2027, Expected Issue Date 26th February 2024
23rd February 2024 | Hong Kong
Singapore Exchange (SGX) is issuing a S$300 million 3-year bond with 3.45% coupon in denomination of S$250,000 maturing February 2027. The expected issue date is 26th February 2024.
“ Singapore Exchange to Issue S$300 Million 3-Year Bond with 3.45% Coupon in Denomination of S$250,000 Maturing February 2027, Expected Issue Date 26th February 2024 “
Singapore Exchange to Issue S$300 Million 3-Year Bond with 3.45% Coupon in Denomination of S$250,000 Maturing February 2027, Expected Issue Date 26th February 2024
Sign Up / Register
Caproasia Users
- Manage $20 million to $3 billion of assets
- Invest $3 million to $300 million
- Advise institutions, billionaires, UHNWs & HNWs
Caproasia Platforms | 11,000 Investors & Advisors
- Caproasia.com
- Caproasia Access
- Caproasia Events
- The Financial Centre | Find Services
- Membership
- Family Office Circle
- Professional Investor Circle
- Investor Relations Network
Monthly Roundtable & Networking
Family Office Programs
The 2025 Investment Day
- March - Hong Kong
- March - Singapore
- July - Hong Kong
- July - Singapore
- Sept- Hong Kong
- Sept - Singapore
- Oct- Hong Kong
- Nov - Singapore
- Visit: The Investment Day | Register: Click here
Caproasia Summits
- The Institutional Investor Summit
- The Investment / Alternatives Summit
- The Private Wealth Summit
- The Family Office Summit
- The CEO & Entrepreneur Summit
- The Capital Markets Summit
- The ESG / Sustainable Investment Summit