Singapore Exchange to Issue S$300 Million 3-Year Bond with 3.45% Coupon in Denomination of S$250,000 Maturing February 2027, Expected Issue Date 26th February 2024
23rd February 2024 | Hong Kong
Singapore Exchange (SGX) is issuing a S$300 million 3-year bond with 3.45% coupon in denomination of S$250,000 maturing February 2027. The expected issue date is 26th February 2024.
“ Singapore Exchange to Issue S$300 Million 3-Year Bond with 3.45% Coupon in Denomination of S$250,000 Maturing February 2027, Expected Issue Date 26th February 2024 “
Singapore Exchange to Issue S$300 Million 3-Year Bond with 3.45% Coupon in Denomination of S$250,000 Maturing February 2027, Expected Issue Date 26th February 2024
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