Hong Kong Launches $2.2 Billion Retail Infrastructure Bond with Issue Date on 17th December 2024 & Listing on Hong Kong Exchange on 18th December 2024, Targeted HKD 20 Billion Issue But Received Only HKD 17.7 Billion ($2.2 Billion) Applications
15th December 2024 | Hong Kong
Hong Kong has launched a $2.2 billion retail infrastructure bond with issue date on 17th December 2024 and listing on Hong Kong Exchange (HKEX) on 18th December 2024. The targeted issue size was HKD 20 billion but received only HKD 17.7 billion ($2.2 billion) applications. Hong Kong Monetary Authority (13/12/24): “The Government announced today (December 13) the subscription and allocation results of the retail infrastructure bond. According to the subscription information submitted by placing banks and the Hong Kong Securities Clearing Company Limited (HKSCC), as at the close of the subscription period at 2pm on December 6, 2024, 127 594 valid applications were received for a total of HK$17,776,530,000 in principal amount of bonds. Allocation is conducted in accordance with the mechanism set out in the Issue Circular dated November 26, 2024. All applications for 100 or fewer lots have been allocated the full amounts applied for, while applications for more than 100 lots have been allocated the maximum principal allocation amount of 100 lots. The final issuance amount of the retail infrastructure bond is HK$17,730,350,000. The retail infrastructure bond will be issued on December 17, 2024, and listed on the Stock Exchange of Hong Kong on December 18, 2024. Notifications on individual allocation results, applicable subscription moneys and amounts of any refund of application moneys will be made by the placing banks and the HKSCC in accordance with the schedule set out in the Issue Circular.”
“ Hong Kong Launches $2.2 Billion Retail Infrastructure Bond with Issue Date on 17th December 2024 & Listing on Hong Kong Exchange on 18th December 2024, Targeted HKD 20 Billion Issue But Received Only HKD 17.7 Billion ($2.2 Billion) Applications “
Hong Kong Launches $2.2 Billion Retail Infrastructure Bond with Issue Date on 17th December 2024 & Listing on Hong Kong Exchange on 18th December 2024, Targeted HKD 20 Billion Issue But Received Only HKD 17.7 Billion ($2.2 Billion) Applications
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